Union Minister Ashwini Vaishnav, while discussing the intricate process of chip manufacturing, said, “First and foremost, the silicon wafer, shaped like a disk, is produced. The chip is then created on top of this wafer. Subsequently, each chip is carefully removed from the wafer using a complex process. It involves the application of electricity supply.
In an interview, he explained that there is a lot of wiring to be done in the body, and electricity supply is provided through a separate process. In this chip, something will be removed from the wafer. A very small thing has been taken out of the wafer, and then it has been given a complete body. In a chip of this size, there will be wiring several kilometers long. The chip manufacturing process is similar to building a five or six-story building, which includes stairs, elevators, electrical connections, and so on. Just like a building is constructed in this way, chips are also made in a similar fashion.
He mentioned that such chips are soon going to be manufactured in India as well. These chips have been imported for use in trains, mobile devices, laptops, tablets, and automobiles, but when their manufacturing begins in India, their cost will decrease. This will significantly benefit the youth by creating employment opportunities.